Tolerance analysis for three-dimensional optoelectronic systems packaging

被引：14

作者：

Morozov, VN

Lee, YC

Neff, JA

OBrien, D

McLaren, TS

Zhou, HJ

机构：

[1] University of Colorado, Optoelectronic Computing Systems Center, Boulder

来源：

OPTICAL ENGINEERING | 1996年 / 35卷 / 07期

关键词：

3-D computer; free-space optical interconnects; smart pixel array; vertical cavity-surface-emitting lasers (VCSEL); optoelectronic packaging; flip-chip assembly;

D O I：

10.1117/1.600782

中图分类号：

O43 [光学];

学科分类号：

070207 ; 0803 ;

摘要：

A series of optoelectronic processing systems is under development at the Optoelectronic Computing System Center (OCSC) at the University of Colorado. The demonstrations consist of two facing optoelectronic modules that communicate with each other using bidirectional free-space optical channels. An analysis of the fabrication tolerances required for correct operation of these systems is presented. An overview of the system and the techniques used for fabrication is given, along with the tolerances achieved in practice. A comparison with theoretical results indicates the critical alignments within the system. Methods to obtain the alignments required for larger systems are discussed. (C) 1996 Society of Photo-Optical Instrumentation Engineers.

引用

页码：2034 / 2044

页数：11

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