共 8 条
[3]
Radical and ion compositions of BCl3/Cl-2 plasma and their relation to aluminum etch characteristics
[J].
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS,
1997, 36 (7B)
:4829-4837
[4]
High rate etching of sapphire wafer using Cl2/BCl3/Ar inductively coupled plasmas
[J].
MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY,
2001, 82 (1-3)
:50-52
[5]
The effect of etching gases on notching and charging in high-density plasma
[J].
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS,
1998, 37 (6A)
:3570-3575
[6]
VANROOSMALEN AJ, 1991, DRY ETCHING VLSI, P116
[7]
Effects of plasma conditions on the shapes of features etched in Cl2 and HBr plasmas.: I.: Bulk crystalline silicon etching
[J].
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS,
1998, 16 (06)
:3247-3258
[8]
Xie DZ, 1998, J PHYS D APPL PHYS, V31, P1647, DOI 10.1088/0022-3727/31/14/006