A study of sapphire etching characteristics using BCl3-based inductively coupled plasmas

被引:20
作者
Jeong, CH [1 ]
Kim, DW [1 ]
Kim, KN [1 ]
Yeom, GY [1 ]
机构
[1] Sungkyunkwan Univ, Dept Mat Engn, Suwon 440746, Kyunggi Do, South Korea
来源
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS | 2002年 / 41卷 / 10期
关键词
BCl3-based inductively coupled plasmas; sapphire etching; Cl-2/BCl3; HCl/BCl3; HBr/BCl3; photoresist etch mask;
D O I
10.1143/JJAP.41.6206
中图分类号
O59 [应用物理学];
学科分类号
摘要
Cl-2, HCl, and HBr added BCl3-based inductively coupled plasmas were used to etch (0001) sapphire wafers and their etch characteristics were investigated. The plasma characteristics were monitored in-situ by optical emission ion spectroscope and a Langmuir probe. A photoresist was used as the etch mask and an etch selectivity greater than 1 with the etch rate of 3800Angstrom/min could be obtained with 20%cHCl/80%/BCl3. The most anisotropic etch profile could be observed in 10% HBr/90%cBCl(3).
引用
收藏
页码:6206 / 6208
页数:3
相关论文
共 8 条
[1]   Fast etching and metallization of via-holes in sapphire with the help of radiation by a copper vapor laser [J].
Dolgaev, SI ;
Lyalin, AA ;
Simakin, AV ;
Voronov, VV ;
Shafeev, GA .
APPLIED SURFACE SCIENCE, 1997, 109 :201-205
[2]   Fast etching of sapphire by a visible range quasi-cw laser radiation [J].
Dolgaev, SI ;
Lyalin, AA ;
Simakin, AV ;
Shafeev, GA .
APPLIED SURFACE SCIENCE, 1996, 96-8 :491-495
[3]   Radical and ion compositions of BCl3/Cl-2 plasma and their relation to aluminum etch characteristics [J].
Kazumi, H ;
Hamasaki, R ;
Tago, K .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1997, 36 (7B) :4829-4837
[4]   High rate etching of sapphire wafer using Cl2/BCl3/Ar inductively coupled plasmas [J].
Sung, YJ ;
Kim, HS ;
Lee, YH ;
Lee, JW ;
Chae, SH ;
Park, YJ ;
Yeom, GY .
MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, 2001, 82 (1-3) :50-52
[5]   The effect of etching gases on notching and charging in high-density plasma [J].
Tabara, S .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1998, 37 (6A) :3570-3575
[6]  
VANROOSMALEN AJ, 1991, DRY ETCHING VLSI, P116
[7]   Effects of plasma conditions on the shapes of features etched in Cl2 and HBr plasmas.: I.: Bulk crystalline silicon etching [J].
Vyvoda, MA ;
Lee, H ;
Malyshev, MV ;
Klemens, FP ;
Cerullo, M ;
Donnelly, VM ;
Graves, DB ;
Kornblit, A ;
Lee, JTC .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1998, 16 (06) :3247-3258
[8]  
Xie DZ, 1998, J PHYS D APPL PHYS, V31, P1647, DOI 10.1088/0022-3727/31/14/006