Mechanical properties of Ph/Sn Pb/In and Sn-In solders

被引:32
作者
Jones, WK [1 ]
Liu, YQ
Shah, ML
Clarke, R
机构
[1] Florida Int Univ, Dept Mech Engn, Miami, FL 33199 USA
[2] Teledyne Elect Technol, Los Angeles, CA USA
关键词
fracture; mechanical properties; solder; uniform elongation;
D O I
10.1108/09540919810203847
中图分类号
T [工业技术];
学科分类号
08 [工学];
摘要
The mechanical properties of eight solder alloys from the Pb-Sn-ln-Ag alloy systems were determined over the temperature range -200 degrees C to 100 degrees C, using uniaxial tensile tests, dynamic mechanical analysis (DMA), acoustic pulse methods and dilatometry. In general, the strength and elastic modulus of the alloys studied was inversely dependent on temperature. PbSn, PbIn and SnIn alloys were observed to turn superplastic with elongations over 100 per cent at temperatures of 50 degrees C or above, The Pb-based and In-Sn eutectic solders possessed superplasticity at temperatures greater than 50 degrees C, From these results, deformation and fracture processes are reviewed, and the appropriate fracture mechanism is proposed.
引用
收藏
页码:37 / +
页数:6
相关论文
共 11 条
[1]
A MICROSTRUCTURAL STUDY OF THE THERMAL FATIGUE FAILURES OF 60SN-40PB SOLDER JOINTS [J].
FREAR, D ;
GRIVAS, D ;
MORRIS, JW .
JOURNAL OF ELECTRONIC MATERIALS, 1988, 17 (02) :171-180
[2]
FREAR D, 1987, EFFECTS LOAD THERMAL, P113
[3]
FREAR DR, 1988, J METAL, V40
[4]
GONZALEZ GL, 1995, P SOUTH 95 FT LAUD F
[5]
MECHANICAL CHARACTERISTICS OF 96.5SN/3.5AG SOLDER IN MICROBONDING [J].
HARADA, M ;
SATOH, R .
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1990, 13 (04) :736-742
[6]
JONES WK, 1996, ISEPT SHANGH
[7]
JONES WK, 1991, INT J MICROELECTRONI, V14
[8]
LIU YQ, P ISEPT 96 SHANGH
[9]
MORGAN HS, 1991, ASME J ELECT PACKAG, V113, P350
[10]
SAVAGE EI, 1990, P INT S MICR