Interface characterisation and correlation with the creep behaviour of a 2.5D SiC/C/SiC composite

The interfacial behaviour of a 2.5D woven SiC/C/SiC composite under creep conditions has been studied by means of fibre push down tests performed with a nanoindentation system. For two samples tested in creep at 1000 and 1100 degreesC the interface was initially cohesioned whereas for a sample tested at 1300 degreesC the interface is partially decohesioned. Moreover, the interface of the sample tested at 1100 degreesC differs from that of the sample tested at 1000 degreesC because only sudden debond is observed. Fractographic and microstructural analyses have been performed in each specimen in order to define possible correlations between measured parameters such as fibre and bundle pullout, oxidation, temperature, etc. and interfacial mechanical properties. (C) 2002 Elsevier Science Ltd. All rights reserved.