Bonding of soda-lime glass microchips at low temperature

被引：27

作者：

Iles, Alexander

Oki, Akio

Pamme, Nicole

机构：

[1] Univ Hull, Dept Chem, Kingston Upon Hull HU6 7RX, N Humberside, England

[2] NIMS, Horiike Grp, Tsukuba, Ibaraki 3050044, Japan

[3] NIMS, Int Ctr Young Scientists, Tsukuba, Ibaraki 3050044, Japan

来源：

MICROFLUIDICS AND NANOFLUIDICS | 2007年 / 3卷 / 01期

关键词：

soda-lime glass microchips; pressure-assisted bonding; microchip fabrication;

D O I：

10.1007/s10404-006-0101-z

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 [材料科学与工程]; 080502 [材料学];

摘要：

A simple, low-temperature bonding process is described for the fabrication of soda-lime glass microfluidic chips. Due to its chemical inertness and temperature stability, glass remains a popular material for microfluidic chips despite the advances that have been made with polymer materials. Conventional thermal bonding is performed over the course of 24 h at 600 degrees C and requires a precise temperature-controlled furnace. Here we introduce a simple low-temperature alternative for the high-strength bonding of soda-lime glass wafers based on the use of diluted HF solution in combination with pressure at a temperature of 65 degrees C.

引用

页码：119 / 122

页数：4

共 8 条

[1]

Room temperature bonding of micromachined glass devices for capillary electrophoresis [J].