Moisture migration and cracking in plastic quad flat packages (PQFPs)

被引:3
作者
Taylor, SA [1 ]
Chen, K [1 ]
Mahajan, R [1 ]
机构
[1] UNIV UTAH,DEPT MECH ENGN,SALT LAKE CITY,UT 84112
关键词
D O I
10.1115/1.2792224
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Moisture migration in PQFPs (plastic quad flat packages) was investigated analytically and experimentally. Coupons made of the molding compound material were exposed to humid air for an extended time to determine its equilibrium moisture composition as a function of environmental moisture level. An IR (infrared) heating test was designed to simulate the high-temperature heat reflow process when PQFPs are soldered on computer boards. The C-SAM (C-mode Scanning Acoustic Microscopy) technique was employed to measure the delaminated areas. All packages failed after IR heating when the moisture content in PQFPs was higher than 60 percent of the equilibrium composition.
引用
收藏
页码:85 / 88
页数:4
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