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Integrated circuit technology options for RFIC's - Present status and future directions
被引：9
作者：
Larson, LE
机构：
来源：
PROCEEDINGS OF THE IEEE 1997 CUSTOM INTEGRATED CIRCUITS CONFERENCE
|
1997年
关键词：
D O I：
10.1109/CICC.1997.606607
中图分类号：
TM [电工技术];
TN [电子技术、通信技术];
学科分类号：
0808 ;
0809 ;
摘要：
This paper will summarize the technology tradeoffs that are involved in the implementation of radio frequency integrated circuits for wireless communications. Radio transceiver circuits have a very broad range of requirements - including noise-figure, linearity, gain, power dissipation. The advantages and disadvantages of each of the competing technologies - Si CMOS, and BJT, Si/SiGe HBTs, and GaAs MESFETs, PHEMTS and HBTs will be examined.
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页码：169 / 176
页数：8
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