256X256 CMOS active pixel sensor camera-on-a-chip

被引:97
作者
Nixon, RH [1 ]
Kemeny, SE [1 ]
Pain, B [1 ]
Staller, CO [1 ]
Fossum, ER [1 ]
机构
[1] CALTECH,JET PROP LAB,CTR SPACE MICROELECT TECHNOL,PASADENA,CA 91109
基金
美国国家航空航天局;
关键词
D O I
10.1109/4.545830
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A CMOS imaging senses is described that uses active pixel sensor (APS technology and permits the integration of the detector array with on-chip timing, control, and signal chain electronics, This sensor technology has been used to implement a CMOS APS camera-on-a-chip. The camera-on-a-chip features a 256 x 256 APS sensor integrated on a CMOS chip with the timing and control circuits, and signal-conditioning to enable random-access, low power (similar to 5 mW) operation, and low read noise (13 e(-) rms). The chip features simple power supplies, fast readout rates, and a digital interface for commanding the sensor, as well as for programming the window-of-interest readout and exposure times, Excellent imaging has been demonstrated with the APS camera-om-a-chip, and the measured performance indicates that this technology will be competitive with charge-coupled devices (CCD's) in many applications.
引用
收藏
页码:2046 / 2050
页数:5
相关论文
共 7 条
[1]  
DICKINSON A, 1995, ISSCC FEB, P226
[2]   ARCHITECTURES FOR FOCAL PLANE IMAGE-PROCESSING [J].
FOSSUM, ER .
OPTICAL ENGINEERING, 1989, 28 (08) :865-871
[3]  
KEMENY SE, 1991, CHARGE COUPLED DEV 2, V1447, P243
[4]  
MENDIS S, IN PRESS IEEE J SOLI
[5]  
MENDIS SK, 1994, P SOC PHOTO-OPT INS, V2172, P19, DOI 10.1117/12.172769
[6]  
MENDIS SK, 1993, IEEE IEDM DEC
[7]  
NIXON RH, 1995, CHARGE COUPLED DEV 5, V2415, P117