Performance and simulation of thermoplastic micro injection molding

被引：123

作者：

Piotter, V ^{[1
]}

Mueller, K ^{[1
]}

Plewa, K ^{[1
]}

Ruprecht, R ^{[1
]}

Hausselt, J ^{[1
]}

机构：

[1] Forschungszentrum Karlsruhe GmbH, Inst Mat Forsch 3, D-76021 Karlsruhe, Germany

来源：

MICROSYSTEM TECHNOLOGIES | 2002年 / 8卷 / 06期

关键词：

D O I：

10.1007/S00542-002-0178-6

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Originally developed for the replication of high aspect ratio LIGA structures, micro injection molding is presently on its way to become an established manufacturing process. Enhanced technological products like micro optical devices are entering the market. New developments like the different kinds of injection molding with several components open up opportunities for increasing economic efficiency as well as for new fields of applications. Software tools for the simulation of the thermal household of the molding tool and/or the moldfilling process itself can provide useful but not wholly sufficient assistance for the optimization of micro injection molding.

引用

页码：387 / 390

页数：4

共 7 条

[1]

MICHAELI W, 1999, ANN SET, V107, P51

[2]

NORAJITRA P, 1996, P WERKST 1996 S 8 DG, P279

[3]

ROGALLA A, 1998, THESIS RWTH AACHEN

[4]

RUPRECHT R, 2000, P 4 STAT MIKR, P31

[5]

Schinköthe W, 2000, KUNSTST-PLAST EUR, V90, P62

[6]

SCHWORER M, 1998, 6189 FZK

[7] RibCon®:: Micromolded easy-assembly multi fiber connector for single- and multimode applications [J].

Wallrabe, U ;

Dittrich, H ;

Friedsam, G ;

Hanemann, T ;

Mohr, J ;

Müller, K ;

Piotter, V ;

Ruther, P ;

Schaller, T ;

Zissler, W .

DESIGN,TEST INTEGRATION, AND PACKAGING OF MEMS/MOEMS 2001, 2001, 4408 :478-485

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