Phase diagrams of Pb-free solders and their related materials systems

被引:113
作者
Chen, Sinn-Wen [1 ]
Wang, Chao-Hong [1 ]
Lin, Shih-Kang [1 ]
Chiu, Chen-Nan [1 ]
机构
[1] Natl Tsing Hua Univ, Dept Chem Engn, Hsinchu, Taiwan
关键词
D O I
10.1007/s10854-006-9010-x
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Replacing Pb-Sn with Pb-free solders is one of the most important issues in the electronic industry. Melting, dissolution, solidification and interfacial reactions are encountered in the soldering processes. Phase diagrams contain equilibrium phase information and are important for the understanding and prediction of phase transformation and reactive phase formation at the solder joints. This study reviews the available phase diagrams of the promising Pb-free solders, and their related materials systems. The solders are Sn-Ag, Sn-Cu, Sn-Ag-Cu, Sn-Zn, Sn-Bi, Sn-In and Sn-Sb. The materials systems are the solders with the Ag, Au, Cu, Ni substrates, such as Sn-Ag-Au, Sn-Ag-Ni, Sn-Cu-Au, and Sn-Cu-Ni ternary systems. For the Pb-free solders and their related ternary and quaternary systems, preliminary phase equilibria information is available; however, complete and reliable phase diagrams over the entire compositional and temperature ranges of soldering interests are lacking.
引用
收藏
页码:19 / 37
页数:19
相关论文
共 116 条
[1]   Lead-free solders in microelectronics [J].
Abtew, M ;
Selvaduray, G .
MATERIALS SCIENCE & ENGINEERING R-REPORTS, 2000, 27 (5-6) :95-141
[2]  
Bath J., 2000, CIRCUITS ASSEMBLY, V5, P31
[3]  
BHARGAVA MK, 1976, Z METALLKD, V67, P318
[4]  
Blair HD, 1998, ELEC COMP C, P259
[5]  
BOETTINGER WJ, 1993, MECH SOLDER ALLOY WE, P103
[6]  
BURKHARDT W, 1959, Z METALLKD, V50, P442
[7]   Intermetallic compounds formed during the soldering reactions of eutectic Sn-9Zn with Cu and Ni substrates [J].
Chan, YC ;
Chiu, MY ;
Chuang, TH .
ZEITSCHRIFT FUR METALLKUNDE, 2002, 93 (02) :95-98
[8]   Primary solidification phases of the Sn-rich Sn-Ag-Cu-Ni quaternary system [J].
Chang, CA ;
Chen, SW ;
Chiu, CN ;
Huang, YC .
JOURNAL OF ELECTRONIC MATERIALS, 2005, 34 (08) :1135-1142
[9]   Interfacial reactions in the Sn-(Ag)/(Ni,V) couples and phase equilibria of the Sn-Ni-V system at the Sn-Rich corner [J].
Chen, Chih-Chi ;
Chen, Sinn-Wen ;
Kao, Ching-Ya .
JOURNAL OF ELECTRONIC MATERIALS, 2006, 35 (05) :922-928
[10]   Electromigration effect upon the Sn-0.7 wt% Cu/Ni and Sn-3.5 wt% Ag/Ni interfacial reactions [J].
Chen, CM ;
Chen, SW .
JOURNAL OF APPLIED PHYSICS, 2001, 90 (03) :1208-1214