Recent advances in the application of orientation imaging

Since the mid-1980s, electron back-scatter diffraction (EBSD, also known as back-scatter Kikuchi diffraction, BKD) has become a well-known and often used technique for interrogating the local characteristics of microstructures. The more recent development of orientation imaging microscopy (OIM) has led to the practical application of EBSD in obtaining statistically relevant information from bulk materials. Many new developments in OIM technology have evolved recently. One of these is the development of rapid and more reliable mapping of multi-phase alloys. In addition, significant work has been performed on thin film structures including patterned films and integrated circuits for investigation of texture evolution, grain growth, and circuit reliability. An additional example showing the application of OIM on rough surface specimens, such as fracture surfaces, is discussed.