Relationship between deposition and recrystallization textures of copper and chromium electrodeposits

被引:42
作者
Choi, JH [1 ]
Kang, SY [1 ]
Lee, DN [1 ]
机构
[1] Seoul Natl Univ, Sch Mat Sci & Engn, Seoul 151742, South Korea
关键词
D O I
10.1023/A:1004834204320
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The < 100 >, < 111 > and < 110 > textures of copper electrodeposits obtained from copper sulfate baths changed to the < 100 >, < 100 > and <root 310 > textures, respectively, after recrystallization. The textures of chromium electrodeposits obtained from the standard Sargent bath remained unchanged after recrystallization. The results are in agreement with the prediction of the strain energy release maximization model, in which the recrystallized grains orient themselves so that their minimum elastic modulus direction can be parallel to the absolute maximum internal stress direction due to dislocations in the non-recrystallized grains. (C) 2000 Kluwer Academic Publishers.
引用
收藏
页码:4055 / 4066
页数:12
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