Exposure-resolved VLEED from the O-Cu(001): Bonding dynamics

被引：34

作者：

Sun, CQ ^{[1
]}

机构：

[1] MURDOCH UNIV,COOLBELLUP 6150,AUSTRALIA

来源：

VACUUM | 1997年 / 48卷 / 06期

关键词：

ENERGY-ELECTRON-DIFFRACTION; SCANNING TUNNELING MICROSCOPY; LEED FINE-STRUCTURE; INDUCED RECONSTRUCTION; OXYGEN-CHEMISORPTION; SURFACE-STRUCTURE; CU(100) SURFACE; ADSORPTION; CU(001); MODELS;

D O I：

10.1016/S0042-207X(97)00007-9

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The appraisal of an association of the VLEED technique and the new models for oxygen chemisorption [Vacuum, J. Phys. Chem. Solids, in press] motivated and enabled us to seek physical insight into the dynamics of the O-Cu(001) surface reaction. It is shown that the discrete stages revealed by exposure-resolved VLEED can be quantified and interpreted by the process dominated by three bonding parameters: First, one Goldschmidt-contraction ionic bond forms between the O adsorbate and a Cu atom on the surface accompanying the vacating of the missing row. Second, another contracting ionic bond follows between the O and a Cu in the substrate; as a result, the oxygen buckles into the bulk. Then, the ionic bond angle increases leading to the relaxation, and finally, interaction develops between the non-bonding states of the oxygen and the lone-pair-induced metal dipoles. (C) 1997 Elsevier Science Ltd. All rights reserved.

引用

页码：535 / 541

页数：7

共 42 条

[1] THE STRUCTURE OF OXYGEN-ADSORPTION PHASES ON CU(100) [J].