Multiple mechanisms of meiotic recombination

被引:8
作者
Bishop, Douglas K.
机构
[1] Univ Chicago, Dept Radiat & Cellular Oncol, Chicago, IL 60637 USA
[2] Univ Chicago, Dept Mol Genet & Cell Biol, Chicago, IL 60637 USA
关键词
D O I
10.1016/j.cell.2006.11.029
中图分类号
Q5 [生物化学]; Q7 [分子生物学];
学科分类号
071010 ; 081704 ;
摘要
In this issue, Cromie et al. (2006) reveal that different meiotic recombination mechanisms predominate in fission yeast and budding yeast. Budding yeast usually form crossover recombinants through double Holliday junctions, whereas fission yeast unexpectedly appear to form crossover recombinants through single junctions.
引用
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页码:1095 / 1097
页数:3
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