Force driving Cu diffusion into interlayer dielectrics

被引：21

作者：

Fukuda, T ^{[1
]}

Nishino, H ^{[1
]}

Matsuura, A ^{[1
]}

Matsunaga, H ^{[1
]}

机构：

[1] ASET, Totsuka Ku, Yokohama, Kanagawa 2440817, Japan

来源：

JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS | 2002年 / 41卷 / 5B期

关键词：

Cu; diffusion; insulator; I-E characteristics; leakage current; O-2; paramagnetism; magnetic moment; magnetic field; simulation;

D O I：

10.1143/JJAP.41.L537

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

The force driving Cu diffusion into insulators was investigated using a conventional Plasma enhanced chemical vapor deposition (CVD) film formed by Tetraethoxysilane (P-TEOS) and degassed P-TEOS films. The samples of degassed P-TEOS films with Cu electrodes kept in vacuum and N-2 ambient show lower leakage currents than a sample kept in air and that of conventional P-TEOS. An interaction between O-2 molecules included in films and atomic Cu was examined and it was found that an interaction between magnetic moments of atomic Cu and O-2 molecules included in conventional P-TEOS film causes diffusion of Cu into the film.

引用

页码：L537 / L539

页数：3

共 11 条

[1]

Bohr MT, 1995, INTERNATIONAL ELECTRON DEVICES MEETING, 1995 - IEDM TECHNICAL DIGEST, P241, DOI 10.1109/IEDM.1995.499187

[2]

Dunning Jr T. H., 1976, MODERN THEORETICAL C, V3, P1, DOI DOI 10.1007/978-1-4757-0887-5_1

[3]

Frisch M.J., 1998, GAUSSIAN 98

[4]

HAY PJ, 1985, J CHEM PHYS, V82, P299, DOI [10.1063/1.448800, 10.1063/1.448799]

[5]

IKAKURA H, 2000, 2000 AMC P, P92

[6]

*ITRS, 2001, INT TECHN ROADM SEM

[7]

Kittel C., 1953, Introduction to Solid-state Physics

[8] Kinetics of copper drift in PECVD dielectrics [J].

Loke, ALS ;

Ryu, C ;

Yue, CP ;

Cho, JSH ;

Wong, SS .

IEEE ELECTRON DEVICE LETTERS, 1996, 17 (12) :549-551

[9] DIFFUSION OF COPPER THROUGH DIELECTRIC FILMS UNDER BIAS TEMPERATURE STRESS [J].

RAGHAVAN, G ;

CHIANG, C ;

ANDERS, PB ;

TZENG, SM ;

VILLASOL, R ;

BAI, G ;

BOHR, M ;

FRASER, DB .

THIN SOLID FILMS, 1995, 262 (1-2) :168-176

[10]

TAKEDA K, 2001, 2001 IITC P, P244

← 1 2 →