Speed it up to 10 Gb/s and flip chip it:: VCSELs today

被引：8

作者：

Grabherr, M ^{[1
]}

Wiedenmann, D ^{[1
]}

King, R ^{[1
]}

Jäger, R ^{[1
]}

Schneider, B ^{[1
]}

机构：

[1] ULM Photon GmbH, D-89081 Ulm, Germany

来源：

VERTICAL-CAVITY SURFACE-EMITTING LASERS VI | 2002年 / 4649卷

关键词：

semiconductor laser arrays; surface-emitting lasers; VCSELs; optical interconnections; high-speed modulation; flip-chip bonding; lifetime testing;

D O I：

10.1117/12.469225

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Accumulation of all advantageous properties VCSELs are famous for, like low power consumption, circular low divergent beam profile, high modulation bandwidth, and scalability of monolithic arrangements, results in two-dimensional (2D) VCSEL arrays that appear as key components to reach highest aggregate bandwidths of tomorrow's parallel optical transceivers. We report on 2D VCSEL arrays, substrate emitting although operating at 850 nm and prepared for flip-chip bonding, that are well suited for the customer's needs in terms of speed, power consumption, reliability and compact integration. Based on advanced technology, our arrays target the requirements of transceivers in the OC-192 VSR and 10 Gigabit Ethernet arena. In this paper we present the basic technology, static and dynamic device characteristics as well as reliability data for a 4x12 850 nm bottom-emitting VCSEL array.

引用

页码：11 / 18

页数：8

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