Science and technology of high dielectric constant thin films and materials integration for application to high frequency devices

被引:42
作者
Auciello, O [1 ]
Saha, S [1 ]
Kaufman, DY [1 ]
Streiffer, SK [1 ]
Fan, W [1 ]
Kabius, B [1 ]
Im, J [1 ]
Baumann, P [1 ]
机构
[1] Argonne Natl Lab, Div Mat Sci, Argonne, IL 60439 USA
关键词
high dielectric constant; thin films; high-frequency devices;
D O I
10.1023/B:JECR.0000034006.59246.5e
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Thin films of Ba1-xSrxTi1+yO3+z (BST), were fabricated using both by RF-magnetron sputtering and MOCVD to demonstrate application to high frequency devices. Precise control of composition and microstructure is critical for the production of (BaxSr1-x) Ti1+yO3+z (BST) dielectric thin films with the large dependence of permittivity on electric field, low losses, and high electrical breakdown fields that are required for successful integration of BST into tunable high frequency devices. Here we review results on composition-microstructure-electrical property relationships of polycrystalline BST films produced by magnetron sputter deposition that are appropriate for microwave devices such as phase shifters. BST films with a multilayer structure were also developed with different Ti-elemental ratio in each layer to minimize losses and leakage current. Interfacial contamination from C and H species was studied and implications on electrical properties are highlighted. Finally, York's group at the University of California-Santa Barbara successfully integrated our BST films onto phase shifter arrays. The results show potential of BST films in such applications. Results from initial work on the integration of Cu-electrodes with BST films are also presented.
引用
收藏
页码:119 / 131
页数:13
相关论文
共 25 条
[1]   Conducting barriers for vertical integration of ferroelectric capacitors on Si [J].
Aggarwal, S ;
Dhote, AM ;
Li, H ;
Ankem, S ;
Ramesh, R .
APPLIED PHYSICS LETTERS, 1999, 74 (02) :230-232
[2]   Studies of multicomponent oxide films and layered heterostructure growth processes via in situ, time-of-flight ion scattering and direct recoil spectroscopy [J].
Auciello, O ;
Krauss, AR ;
Im, J ;
Schultz, JA .
ANNUAL REVIEW OF MATERIALS SCIENCE, 1998, 28 :375-396
[3]   The dielectric response as a function of temperature and film thickness of fiber-textured (Ba,Sr)TiO3 thin films grown by chemical vapor deposition [J].
Basceri, C ;
Streiffer, SK ;
Kingon, AI ;
Waser, R .
JOURNAL OF APPLIED PHYSICS, 1997, 82 (05) :2497-2504
[4]  
BAUMANN PK, 2001, INTEGR FERROELECTR, V34, P255
[5]   LOW RESISTIVITY BODY-CENTERED CUBIC TANTALUM THIN-FILMS AS DIFFUSION-BARRIERS BETWEEN COPPER AND SILICON [J].
CATANIA, P ;
DOYLE, JP ;
CUOMO, JJ .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1992, 10 (05) :3318-3321
[6]   Planar microwave integrated phase-shifter design with high purity ferroelectric material [J].
DeFlaviis, F ;
Alexopoulos, NG ;
Stafsudd, OM .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1997, 45 (06) :963-969
[7]   Studies of thin film growth and oxidation processes for conductive Ti-Al diffusion barrier layers via in situ surface sensitive analytical techniques [J].
Dhote, AM ;
Auciello, O ;
Gruen, DM ;
Ramesh, R .
APPLIED PHYSICS LETTERS, 2001, 79 (06) :800-802
[8]   Leakage currents in Ba0.7Sr0.3TiO3 thin films for ultrahigh-density dynamic random access memories [J].
Dietz, GW ;
Schumacher, M ;
Waser, R ;
Streiffer, SK ;
Basceri, C ;
Kingon, AI .
JOURNAL OF APPLIED PHYSICS, 1997, 82 (05) :2359-2364
[9]   Layered Cu-based electrode for high-dielectric constant oxide thin film-based devices [J].
Fan, W ;
Saha, S ;
Carlisle, JA ;
Auciello, O ;
Chang, RPH ;
Ramesh, R .
APPLIED PHYSICS LETTERS, 2003, 82 (09) :1452-1454
[10]  
FAN W, 2003, J APPL LETT, V94