The essential role played by adhesion in the technology of neurological prostheses

被引：18

作者：

Donaldson, PEK

机构：

[1] Highclere, Otford, Sevenoaks, Kent, TN14 5RR, Greenhill Road

来源：

INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES | 1996年 / 16卷 / 02期

关键词：

microelectronic implants; encapsulation; adhesion;

D O I：

10.1016/0143-7496(95)00031-3

中图分类号：

TQ [化学工业];

学科分类号：

0817 ;

摘要：

Early implanted microelectronic devices suffered premature encapsulation failures, probably because the function of the encapsulant had received insufficient thought. Subsequent research showed that the important property required of an encapsulant was not impermeability, as had been supposed, but adhesion.

引用

页码：105 / 107

页数：3