Approach of a physically based lifetime model for solder layers in power modules

被引：26

作者：

Steinhorst, P. ^{[1
]}

Poller, T. ^{[1
]}

Lutz, J. ^{[1
]}

机构：

[1] Tech Univ Chemnitz, Chemnitz, Germany

来源：

MICROELECTRONICS RELIABILITY | 2013年 / 53卷 / 9-11期

关键词：

CRACK-GROWTH; JOINTS;

D O I：

10.1016/j.microrel.2013.07.094

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

080906 [电磁信息功能材料与结构]; 082806 [农业信息与电气工程];

摘要：

For the calculation of the lifetime of power modules only empirical lifetime models are available. These models represent a best-fit of a large number of results from power cycling tests, and are not derived from a physical model. In this paper a physic-based approach will be presented. Crack propagation in a solder layer, the increase of the thermal resistance and therewith the expected lifetime is calculated. (C) 2013 Elsevier Ltd. All rights reserved.

引用

页码：1199 / 1202

页数：4

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