Nanoporous Copper Films by Additive-Controlled Electrodeposition: CO2 Reduction Catalysis

被引:248
作者
Hoang, Thao T. H. [1 ]
Ma, Sichao [1 ]
Gold, Jake I. [2 ]
Kenis, Paul J. A. [2 ,3 ]
Gewirth, Andrew A. [1 ,3 ]
机构
[1] Univ Illinois, Dept Chem, Urbana, IL 61801 USA
[2] Univ Illinois, Dept Chem & Biomol Engn, Urbana, IL 61801 USA
[3] Kyushu Univ, Int Inst Carbon Neutral Energy Res WPI I2CNER, Fukuoka 8190395, Japan
来源
ACS CATALYSIS | 2017年 / 7卷 / 05期
关键词
CO2; reduction; electrodeposition; copper; 3,5-diamino-1,2,4-triazole; ethylene; ELECTROCHEMICAL REDUCTION; CARBON-DIOXIDE; METALLIC FOAMS; UNDERPOTENTIAL DEPOSITION; CU; CONVERSION; NITRATE; SELECTIVITY; CHALLENGES; MECHANISM;
D O I
10.1021/acscatal.6b03613
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
Electrodeposition from plating baths containing 3,S-diamino-1,2,4-triazole (DAT) as an inhibitor gives Cu films exhibiting high surface area and high CO2 reduction activities. By changes in the pH and deposition current density, the morphologies of the Cu films are varied to exhibit wire, dot, and amorphous structures. Among these Cu films, the CuDAT-wire samples exhibit the best CO2 reduction activities activity with a Faradaic efficiency (FE) for C2H4 product formation reaching 40% at -0.5 V vs RHE, a FE for C2H5OH formation reaching 20% at -0.5 V vs RHE, and a mass activity for CO2 reduction at -0.7 V vs RHE of similar to 700 A/g.
引用
收藏
页码:3313 / 3321
页数:9
相关论文
共 57 条
[1]   Damascene copper electroplating for chip interconnections [J].
Andricacos, PC ;
Uzoh, C ;
Dukovic, JO ;
Horkans, J ;
Deligianni, H .
IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1998, 42 (05) :567-574
[2]  
Bari G.A., 2010, Modern electroplating, V5th
[3]   Resolving surface chemical states in XPS analysis of first row transition metals, oxides and hydroxides: Sc, Ti, V, Cu and Zn [J].
Biesinger, Mark C. ;
Lau, Leo W. M. ;
Gerson, Andrea R. ;
Smart, Roger St. C. .
APPLIED SURFACE SCIENCE, 2010, 257 (03) :887-898
[4]   Electrochemical reduction of nitrate in weakly alkaline solutions [J].
Bouzek, K ;
Paidar, M ;
Sadílková, A ;
Bergmann, H .
JOURNAL OF APPLIED ELECTROCHEMISTRY, 2001, 31 (11) :1185-1193
[5]   METALLIC FOAMS - THEIR PRODUCTION, PROPERTIES AND APPLICATIONS [J].
DAVIES, GJ ;
ZHEN, S .
JOURNAL OF MATERIALS SCIENCE, 1983, 18 (07) :1899-1911
[6]   Structure effects on the energetics of the electrochemical reduction of CO2 by copper surfaces [J].
Durand, William J. ;
Peterson, Andrew A. ;
Studt, Felix ;
Abild-Pedersen, Frank ;
Norskov, Jens K. .
SURFACE SCIENCE, 2011, 605 (15-16) :1354-1359
[7]   Morphology Matters: Tuning the Product Distribution of CO2 Electroreduction on Oxide-Derived Cu Foam Catalysts [J].
Dutta, Abhijit ;
Rahaman, Motiar ;
Luedi, Nicola C. ;
Broekmann, Peter .
ACS CATALYSIS, 2016, 6 (06) :3804-3814
[8]   Cation-anion palladium complexes: the effect of the hydrogen bond character on their stability and biological activity [J].
Efimenko, I. A. ;
Shishilov, O. N. .
RUSSIAN JOURNAL OF INORGANIC CHEMISTRY, 2012, 57 (14) :1695-1722
[9]   A Direct Grain-Boundary-Activity Correlation for CO Electroreduction on Cu Nanoparticles [J].
Feng, Xiaofeng ;
Jiang, Kaili ;
Fan, Shoushan ;
Kanan, Matthew W. .
ACS CENTRAL SCIENCE, 2016, 2 (03) :169-174
[10]   Studies on Degradation of Copper Nano Particles in Cathode for CO2 Electrolysis to Organic Compounds [J].
Garg, Garima ;
Basu, Suddhasatwa .
ELECTROCHIMICA ACTA, 2015, 177 :359-365