Removal mechanisms in polishing of silicon based advanced ceramics

被引：55

作者：

Klocke, Fritz ^{[1
]}

Zunke, Richard ^{[1
]}

机构：

[1] Fraunhofer IPT, D-52074 Aachen, Germany

来源：

CIRP ANNALS-MANUFACTURING TECHNOLOGY | 2009年 / 58卷 / 01期

关键词：

Polishing; Ceramic; Mechanism; NITRIDE;

D O I：

10.1016/j.cirp.2009.03.120

中图分类号：

T [工业技术];

学科分类号：

120111 [工业工程];

摘要：

Advanced ceramics with high surface quality and integrity are of increased interest in mold and die making and optics. The demanded qualities are widely ensured by polishing. However, due to the great variety of parameters and interactions the removal mechanisms are still not fully understood. Therefore, polishing processes of silicon based advanced ceramics are investigated. It is shown that depending on the slurry the material removal mechanisms differ. Observed effects can be explained by dominating mechanical or chemo-mechanical removal. This is discussed based on the phenomenological analysis of experimental results using advanced metrology, such as AFM, SEM and TEM. (c) 2009 CIRP.

引用

页码：491 / 494

页数：4

共 24 条

[1]

Prediction of scratch generation in chemical mechanical planarization [J].