New reconfigurable fiber-chip coupling method for multipurpose packaging with up to 50 GHz modulation bandwidth

被引：2

作者：

Fischer, UHP ^{[1
]}

Peters, K ^{[1
]}

Ziegler, R ^{[1
]}

Pech, D ^{[1
]}

Kilk, A ^{[1
]}

Eckhardt, T ^{[1
]}

Mekonnen, GG ^{[1
]}

Jacumeit, G ^{[1
]}

机构：

[1] Heinrich Hertz Inst Nachrichtentech Berlin GmbH, D-10587 Berlin, Germany

来源：

OPTICAL FIBER TECHNOLOGY | 2000年 / 6卷 / 01期

关键词：

D O I：

10.1006/ofte.1999.0311

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We desired and fabricated a series of modules for one-sided and double-sided fiber-chip coupling of waveguide-fed InP and GaAs OEICs such as diode Lasers, semiconductor amplifiers, and optical modulators. Simultaneous coupling of both chip sides to the fiber is possible with a new patented set-up. The modules are temperature controlled within an ambient temperature range from -10 to +50 degrees C and electrical modulation signals up to 45 GHz can be fed via RF connectors to the OEIC. The coupling loss is typically less than 3 dB with tapered fibers. The package shows good longterm stability and is well suited for prototypes and small-scale production. (C) 2000 Academic Press.

引用

页码：68 / 73

页数：6

共 11 条

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