Sn-Ag-Cu solders and solder joints: Alloy development, microstructure, and properties

被引：39

作者：

Anderson, IE ^{[1
]}

Cook, BA ^{[1
]}

Harringa, JL ^{[1
]}

Terpstra, RL ^{[1
]}

机构：

[1] Iowa State Univ, US DOE, Ames Lab, Met & Ceram Sci Program, Ames, IA 50011 USA

来源：

JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY | 2002年 / 54卷 / 06期

关键词：

Shear Strength; Solder Joint; Solder Alloy; Solder Matrix; Eutectic Solder;

D O I：

10.1007/BF02701845

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Slow cooling of Sn-Ag-Cu and Sn-Ag-Cu-X (X = Fe, Co) solder-joint specimens made by hand soldering simulated reflow in surface-mount assembly to achieve similar as-solidified joint microstructures for realistic shear-strength testing, using Sn-3.5Ag (wt.%) as a baseline. Minor substitutions of either cobalt or iron for copper in Sn-3.7Ag-0.9Cu refined the joint matrix microstructure, modified the Cu6Sn5 intermetallic phase at the copper substrate/solder interface, and increased the shear strength. At elevated (150degreesC) temperature, no significant difference in shear strength was found in all of the alloys studied. Ambient temperature shear strength was reduced by large-scale tin dendrites in the joint microstructure, especially by the coarse dendrites in solute poor Sn-Ag-Cu.

引用

页码：26 / 29

页数：4

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