A 1.2Gb/s/pin wireless superconnect based on inductive inter-chip signaling (IIS)

被引:78
作者
Mizoguchi, D [1 ]
Yusof, YB [1 ]
Miura, N [1 ]
Takayasu, SJ [1 ]
Kuroda, T [1 ]
机构
[1] Keio Univ, Yokohama, Kanagawa 223, Japan
来源
2004 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE, DIGEST OF TECHNICAL PAPERS | 2004年 / 47卷
关键词
D O I
10.1109/ISSCC.2004.1332634
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:142 / 143
页数:2
相关论文
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Burns J., 2001, 2001 IEEE International Solid-State Circuits Conference. Digest of Technical Papers. ISSCC (Cat. No.01CH37177), P268, DOI 10.1109/ISSCC.2001.912632
[2]  
Kanda K, 2003, ISSCC DIG TECH PAP I, V46, P186
[3]  
MICK S, 2002 CICC, P133
[4]  
Usami M, 2003, ISSCC DIG TECH PAP I, V46, P398