InGaAs/InP thermoelectric infrared sensor utilizing surface bulk micromachining technology

被引:20
作者
Dehe, A [1 ]
Pavlidis, D [1 ]
Hong, KS [1 ]
Hartnagel, HL [1 ]
机构
[1] UNIV MICHIGAN,DEPT ELECT ENGN & COMP SCI,ANN ARBOR,MI 48106
关键词
D O I
10.1109/16.595931
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A novel InGaAs/InP micromachined thermoelectric sensor is presented, The key features of the reported sensors are the high thermal resistivity and high mobility of InGaAs lattice matched to InP, combined with a value of Seebeck coefficient that is acceptable for such applications, The anisotropic and selective surface bulk micromachining properties of this material system were successfully applied to devices aligned along the [010] orientation on a [100] InP wafer and the details of the technology used for this purpose are presented, A responsivity of 184 V/W and a relative detectivity of 7.1 x 10(8) cm Hz(-1/2)/W have been demonstrated using this new sensor approach.
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收藏
页码:1052 / 1059
页数:8
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