Thermoviscoelastic analysis for a polymeric composite plate with embedded shape memory alloy wires

被引：16

作者：

Sun, SS

Sun, G ^{[1
]}

Han, F

Wu, JS

机构：

[1] Shanghai Jiao Tong Univ, Dept Engn Mech, Shanghai 200030, Peoples R China

[2] Shanghai Jiao Tong Univ, Dept Mat Sci, Shanghai 200030, Peoples R China

来源：

COMPOSITE STRUCTURES | 2002年 / 58卷 / 02期

基金：

中国国家自然科学基金;

关键词：

shape memory alloy; thermoviscoelasticity; finite element analysis;

D O I：

10.1016/S0263-8223(02)00046-6

中图分类号：

O3 [力学];

学科分类号：

08 ; 0801 ;

摘要：

The deflection of the polymeric-matrix composite plate with embedded shape memory alloy (SMA) wires and subjected to uniform lateral pressure is studied using the finite element method. The behavior of the polymeric composite plate under electrical heating of SMA is analyzed with thermoviscoelastic theory. The actuation of SMA is modeled by Brinson's one-dimensional constitutive equation. The influences of the boundary conditions, the ply orientations and the pre-strains of SMA wires on the deflection of composite plate are discussed. It is found that the effect of thermoviscoelasticity of the polymeric matrix on the actuation of SMA is significant. (C) 2002 Elsevier Science Ltd. All rights reserved.

引用

页码：295 / 302

页数：8

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