Lumped and distributed lattice-type LC-baluns

被引：47

作者：

Bakalski, W ^{[1
]}

Simbürger, W ^{[1
]}

Knapp, H ^{[1
]}

Wohlmuth, HD ^{[1
]}

Scholtz, AL ^{[1
]}

机构：

[1] Infineon Technol AG, D-81730 Munich, Germany

来源：

2002 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-3 | 2002年

关键词：

D O I：

10.1109/MWSYM.2002.1011595

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents two balun circuits derived from the lumped Lattice-type LC-balun. First the lumped LC-balun bridge elements are substituted by microstrip, lines. This results in an improved performance at the 2nd and 3rd harmonic frequency for RF power amplifier output baluns. Secondly, the lumped Lattice-type LC-balun is extended to a dual band balun. Independent impedance transformation and balun conversion can be done at two different frequencies. The design equations are derived.

引用

页码：209 / 212

页数：4

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