Apparatus for accurate measurement of interface resistance of high performance thermal interface materials

被引:27
作者
Gwinn, JP [1 ]
Saini, M [1 ]
Webb, RL [1 ]
机构
[1] Penn State Univ, University Pk, PA 16802 USA
来源
ITHERM 2002: EIGHTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, PROCEEDINGS | 2002年
关键词
experimental apparatus; Thermal Interface Material (TIM); thermal interface resistance; thermal contact resistance; uncertainty; surface flatness; roughness; design;
D O I
10.1109/ITHERM.2002.1012515
中图分类号
O414.1 [热力学];
学科分类号
摘要
This manuscript describes a systematic and rational design of an experimental apparatus based on ASTM D-5470 standard for thermal interface resistance measurement of high performance thermal interface materials (TIM). The apparatus is intended to provide measurement of TIM thermal resistance as low as 0.065 K-cm(2)/W within 10% experimental uncertainty. The key points addressed are: 1) Apparatus design to obtain accurate measurement of TIM surface temperatures and heat flux, 2) Effects of surface flatness and roughness, and 3) Importance of and methods for surface cleaning. Design criteria are presented for choosing temperature sensors, their installation method, meter-bar material and thickness. The temperature sensors in the meterbars should be located a sufficient distance from the heaters to ensure uniform heat flux in the thermal sensor region. Cooling plate design specifications, and a method for applying interface pressure are described. Experimental data are presented on a new TIM having 0.058 K-cm(2)/W interface resistance with 138 kPa contact pressure, which is lower than commercially available thermal grease and phase change materials.
引用
收藏
页码:644 / 650
页数:7
相关论文
共 16 条
[1]  
CARLIN C, 2001, POWERSTRATE
[2]  
EATON M, 2002, THERMAL RESISTANCE T
[3]  
GARY L, 2000, P 7 INT SOC C LAS VE, V1, P48
[4]  
GERS S, 2001, SHIN ETSU MICROSI PR
[5]  
GWINN JP, P THERMES 2002 SANT, P201
[6]  
GWINN JP, P ITHERM 2002
[7]  
HOUSE N, 2001, PRIVATE CORRESPONDEN
[8]  
HOUSE N, 2001, THERMAL INTERFACE BA
[9]  
Incropera F.P., 1990, FUNDAMENTALS HEAT MA
[10]  
*INT CORP, 2000, 249204001 INT CORP