Evolution of surface morphology in TiNiCu shape memory thin films

被引：23

作者：

Fu, Y. Q.

Sanjabi, S.

Barber, Z. H.

Clyne, T. W.

Huang, W. M.

Cai, M.

Luo, J. K.

Flewitt, A. J.

Milne, W. I.

机构：

[1] Univ Cambridge, Dept Engn, Cambridge CB3 0FA, England

[2] Univ Cambridge, Dept Mat Sci & Met, Cambridge CB2 3QZ, England

[3] Nanyang Technol Univ, Sch Mech & Aerosp Engn, Singapore 639798, Singapore

[4] Washington State Univ, Dept Phys & Astron, Pullman, WA 99164 USA

来源：

APPLIED PHYSICS LETTERS | 2006年 / 89卷 / 17期

基金：

英国工程与自然科学研究理事会;

关键词：

D O I：

10.1063/1.2361275

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

A transition of film surface morphology between wrinkling and surface relief during heating/cooling is reported for a sputtered TiNiCu thin film shape memory alloy. The mechanisms for this transition are discussed based on film stress evolution. During annealing surface wrinkling occurs to relieve compressive stress in the film, while the surface relief morphology occurs during cooling due to the martensitic transformation, which relieves tensile stress. (c) 2006 American Institute of Physics.

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页数：3

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