Temperature cycling and thermal shock failure rate modeling

被引：15

作者：

Blish, RC

机构：

来源：

1997 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 35TH ANNUAL | 1997年

关键词：

D O I：

10.1109/RELPHY.1997.584246

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 [电气工程]; 0809 [电子科学与技术];

摘要：

Combining the Coffin-Manson formula with a lognormal distribution continues to be an effective method to model the effects: of thermal stressing upon VLSI IC package reliability, This approach is applied to Thin Film Cracking (TFC) and several other failure mechanisms relevant to IC packages. The Coffin-Manson exponent, m, is found to lie in one of three relatively narrow ranges: m for ductile metal fatigue is similar to 1-3 m for commonly used IC metal alloys and intermetallics is similar to 3-5, while m for brittle fracture is similar to 6-8.

引用

页码：110 / 117

页数：8