A theory of pad conditioning for chemical-mechanical polishing

被引:56
作者
Borucki, LJ
Witelski, T
Please, C
Kramer, PR
Schwendeman, D
机构
[1] Motorola Inc, Tempe, AZ 85284 USA
[2] Duke Univ, Dept Math, Durham, NC 27708 USA
[3] Univ Southampton, Fac Math Studies, Southampton SO17 1BJ, Hants, England
[4] Rensselaer Polytech Inst, Dept Math Sci, Troy, NY 12180 USA
基金
美国国家科学基金会;
关键词
abrasive wear; chemical-mechanical polishing; surface roughness;
D O I
10.1023/B:ENGI.0000042116.09084.00
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Statistical models are presented to describe the evolution of the surface roughness of polishing pads during the pad-conditioning process in chemical-mechanical polishing. The models describe the evolution of the surface-height probability-density function of solid pads during fixed height or fixed cut-rate conditioning. An integral equation is derived for the effect of conditioning on a foamed pad in terms of a model for a solid pad. The models that combine wear and conditioning are then discussed for both solid and foamed pads. Models include the dependence of the surface roughness on the shape and density of the cutting tips used in the conditioner and on other operating parameters. Good agreement is found between the model, Monte Carlo simulations and with experimental data.
引用
收藏
页码:1 / 24
页数:24
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