A model for temperature rise of polishing process considering effects of polishing pad and abrasive

The contact temperature plays an important role in the polishing process, which essentially is a sur(ace contact abrasion process. This paper reports a contact temperature model to predict the temperature rise of both the abrasive-workpiece and pad-workpiece interfaces in a polishing process. In this analysis, the forces acting on an abrasive particle and an asperity of the pad are derived from a mechanistic analysis of abrasive-workpiece and pad-workpiece contact. Our results elucidate that polishing with a rigid, smooth plate is a special case of our purposed model. Theoretical predictions indicate that the temperature rise of abrasive-workpiece contact increases with an increase in particle size and density of particles, hardness of workpiece, hardness of pad, and with a decrease in thermal conductivity of workpiece. The temperature of pad-workpiece contact increases with an increase in hardness of pad and surface roughness of pad, and with a decrease in thermal conductivity of workpiece. The contact temperature rise of the pad-workpiece interface is independent of the hardness of workpiece. For a metal polishing process, the maximum contact temperature occurs at the pad-workpiece contact point for small abrasive particles and rough polishing pad with high hardness.