Direct ink-jet printing and low temperature conversion of conductive silver patterns

被引:228
作者
Smith, P. J.
Shin, D. -Y.
Stringer, J. E.
Derby, B.
Reis, N.
机构
[1] Univ Manchester, Sch Mat, Manchester M1 7HS, Lancs, England
[2] ICEMS, P-1049001 Lisbon, Portugal
关键词
D O I
10.1007/s10853-006-6653-1
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
A drop-on-demand ink-jet printer has been used in the production of conductive silver tracks onto glass, polyimide, polytetrafluoroethylene, carbon and glass fibre reinforced epoxy substrates. Silver patterns were obtained from an organometallic solution by heat treatment at 150 degrees C in air and were found to have resistivity values of 1.3 to 2 times the theoretical resisitivity of bulk silver. Printed track lateral resolution is a function of the ink/substrate wetting behaviour and a simple model is presented that relates track width to equilibrium contact angle. The influence of printing parameters and substrate surface properties on line quality is discussed. (c) 2006 Springer Science + Business Media, Inc.
引用
收藏
页码:4153 / 4158
页数:6
相关论文
共 14 条
[2]   Capillary flow as the cause of ring stains from dried liquid drops [J].
Deegan, RD ;
Bakajin, O ;
Dupont, TF ;
Huber, G ;
Nagel, SR ;
Witten, TA .
NATURE, 1997, 389 (6653) :827-829
[3]   HYDRODYNAMICS OF SMALL TUBULAR PUMPS [J].
DIJKSMAN, JF .
JOURNAL OF FLUID MECHANICS, 1984, 139 (FEB) :173-191
[4]   Ink-jet printed nanoparticle microelectromechanical systems [J].
Fuller, SB ;
Wilhelm, EJ ;
Jacobson, JM .
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2002, 11 (01) :54-60
[5]  
KAYDANOVA T, 2003, P NAT CTR PHOT SOL P
[6]  
LIDE DR, 1996, HDB CHEM PHYS, P12
[7]  
Molesa S., 2003, MAT RES SOC, V769, P1
[8]   Ink jet deposition of ceramic suspensions: Modelling and experiments of droplet formation [J].
Reis, N ;
Derby, B .
MATERIALS DEVELOPMENT FOR DIRECT WRITE TECHNOLOGIES, 2000, 624 :65-70
[9]  
REIS N, IN PRESS J APPL PHYS
[10]   Fine-line conductor manufacturing using drop-on-demand PZT printing technology [J].
Szczech, JB ;
Megaridis, CM ;
Gamota, DR ;
Zhang, J .
IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2002, 25 (01) :26-33