Anti-adhesive layers on nickel stamps for nanoimprint lithography

被引：65

作者：

Park, S

Schift, H ^{[1
]}

Padeste, C

Schnyder, B

Kötz, R

Gobrecht, J

机构：

[1] Paul Scherrer Inst, Lab Micro & Nanotechnol, CH-5232 Villigen, Switzerland

[2] Paul Scherrer Inst, Electrochem Lab, CH-5232 Villigen, Switzerland

来源：

MICROELECTRONIC ENGINEERING | 2004年 / 73-4卷

关键词：

anti-adhesive layer; fluorinated silane; Ni stamp; nanoimprint lithography;

D O I：

10.1016/j.mee.2004.02.040

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A new route to use silane chemistry as a means of improving anti-sticking properties of Ni stamps for nanoimprint lithography was developed. The surfaces and the corresponding anti-sticking properties for the coatings of a fluorinated silane on three different oxidized surfaces on Ni, namely oxidized Ni, oxidized Ti on Ni, and SiO2 on Ni, were investigated using atomic/lateral force microscopy, contact angle measurement, X-ray photoelectron spectroscopy, and imprint tests. The surface energies and the friction constants for the silane coatings are found to be in the order NiO/Ni > TiO2/Ni > SiO2/Ni, indicating that an introduction of a SiO2 interlayer is most effective to achieve a better anti-adhesive coating. This is also supported by simultaneous imprint tests with sinusoidal gratings of different coatings, where no failure appears for the coating with a SiO2 interlayer. (C) 2004 Elsevier B.V. All rights reserved.

引用

页码：196 / 201

页数：6

共 9 条

[1]

BECK M, 2003, THESIS LUND U, P28

[2] Imprint lithography with sub-10 nm feature size and high throughput [J].