The combination of high thermal and electrical conductivity of copper with thermal resistance of tungsten is of great interest for industry. The different heat expansion coefficients, however, post: a serious problem to the coexistence of the two phases. The possible solution can be found in creating a composition gradient between the two metals. The aims of the present work were to investigate the residual stress states in various W/Cu gradient materials and to compare the experimental results with model simulations. (C) 2000 Elsevier Science B.V. All rights reserved.