Integration of Polymer/Ceramic thin film capacitor on PWB

被引:12
作者
Bhattacharya, S
Tummala, RR
Chahal, P
White, G
机构
来源
3RD INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS - PROCESSES, PROPERTIES, AND INTERFACES - PROCEEDINGS | 1997年
关键词
D O I
10.1109/ISAPM.1997.581259
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 [电气工程]; 0809 [电子科学与技术];
摘要
Electrical properties of various Polymer-Ceramic composites have been studied for use in integrated capacitors on PWB substrates. The dielectric constant of the composite is strongly dependent on the individual properties of polymer and ceramic materials. Epoxy is the material of choice for its compatibility with PWBs. Further, epoxy materials are not attacked by high PH environment during electroless plating of the capacitor electrodes. Photodefinable and nonphotodefinable materials have been evaluated for capacitor integration on PWBs using thin-film processes and screen printing. Lead magnesium niobate is selected as the filler material for its high dielectric constant value and its compatibility with most polymers [1,2].
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页码:68 / 70
页数:3
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