Bromine adsorption, reaction, and etching of Cu(100)

被引:26
作者
Nakakura, CY
Altman, EI
机构
[1] YALE UNIV,DEPT CHEM ENGN,NEW HAVEN,CT 06520
[2] YALE UNIV,DEPT APPL PHYS,NEW HAVEN,CT 06520
基金
美国国家科学基金会;
关键词
adsorption kinetics; bromine; chemisorption; compound formation; copper; corrosion; etching; evaporation and sublimation; halides; halogens; low energy electron diffraction (LEED); low index single crystal surfaces; molecule-solid reactions; oxidation; thermal desorption spectroscopy;
D O I
10.1016/S0039-6028(96)00950-8
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
The interaction of Br-2 with Cu(100) was characterized using temperature-programmed desorption (TPD) and low-energy electron diffraction (LEED). Initial exposure to Br-2 resulted in the formation of a c(2 x 2) LEED pattern and CuBr desorption peaks at 870 and 1000 K. These desorption peaks saturated at a dose of approximately 5 L and were attributed to Br chemisorption. Continued exposure to Br-2 resulted in the growth of Cu3Br3 desorption peaks associated with the formation of bulk CuBr. The Cu3Br3 desorption peaks exhibited a strong coverage dependence. At low CuBr coverages, desorption peaks at 450 and 485 K were observed, while at intermediate coverages a third peak at 540 K was observed, and at high coverages a single broad peak at 500 K was observed. Similar results were obtained whether the CuBr layer was formed by exposure to Br-2 or by deposition of Cu3Br3 onto a c(2 x 2) layer. The two higher-temperature peaks were shown to be consistent with sublimation of alpha and beta CuBr, while the lowest-temperature peak could not be associated with sublimation of any bulk phase of CuBr. The lowest-temperature peak was attributed to either a grain-size effect or to the interaction of CuBr with chemisorbed Br. At 325 K, growth of CuBr resulted in a hexagonal LEED pattern that disappeared upon annealing to 400 K. Again, the same results were obtained for CuBr formed by reaction with Br-2 and by vapor deposition of Cu3Br3, suggesting that the reaction produces near-equilibrium structures. The hexagonal LEED pattern was attributed to compressed epitaxial CuBr(lll). The reaction of Br-2 with Cu(100) was characterized by a constant sticking coefficient, indicating that the reaction is adsorption-rate limited over the range studied. The sticking coefficient was found to depend on temperature in two distinct ways: (i) annealing the c(2 x 2) layer irreversibly increases the sticking coefficient, and (ii) the sticking coefficient reversibly decreases with increasing reaction temperature. The first effect was attributed to structural changes in the chemisorbed layer.
引用
收藏
页码:32 / 46
页数:15
相关论文
共 37 条
  • [1] [Anonymous], 1993, METALLIZATION THEORY
  • [2] MULTIPLE SCATTERING VERSUS SUPERSTRUCTURES IN LOW ENERGY ELECTRON DIFFRACTION
    BAUER, E
    [J]. SURFACE SCIENCE, 1967, 7 (03) : 351 - &
  • [3] THE STRUCTURE OF THIN NIO(100) FILMS GROWN ON NI(100) AS DETERMINED BY LOW-ENERGY-ELECTRON DIFFRACTION AND SCANNING TUNNELING MICROSCOPY
    BAUMER, M
    CAPPUS, D
    KUHLENBECK, H
    FREUND, HJ
    WILHELMI, G
    BRODDE, A
    NEDDERMEYER, H
    [J]. SURFACE SCIENCE, 1991, 253 (1-3) : 116 - 128
  • [4] THE ADSORPTION OF CHLORINE AND CHLORIDATION OF AG(III)
    BOWKER, M
    WAUGH, KC
    [J]. SURFACE SCIENCE, 1983, 134 (03) : 639 - 664
  • [5] ETCHING OF SI(100)-2X1 WITH CHLORINE - REACTION PATHWAYS, ENERGY ANISOTROPIES, AND ATOMIC-SCALE PHENOMENA
    CHANDER, M
    GOETSCH, DA
    ALDAO, CM
    WEAVER, JH
    [J]. PHYSICAL REVIEW B, 1995, 52 (11): : 8288 - 8294
  • [6] CHUANG TJ, 1986, SURF SCI, V176, P32
  • [7] GEOMETRY AND ELECTRONIC-STRUCTURE OF CL ON THE CU(001) SURFACE
    CITRIN, PH
    HAMANN, DR
    MATTHEISS, LF
    ROWE, JE
    [J]. PHYSICAL REVIEW LETTERS, 1982, 49 (23) : 1712 - 1715
  • [8] RELATIONSHIP BETWEEN VIBRATIONAL-STATES OF O-NI SYSTEMS AND THEIR SUPERFICIAL STRUCTURE ON (100) FACE OF NICKEL SINGLE-CRYSTAL
    DALMAIIMELIK, G
    BERTOLINI, JC
    ROUSSEAU, J
    [J]. SURFACE SCIENCE, 1977, 63 (01) : 67 - 78
  • [9] LOW-TEMPERATURE COPPER ETCHING VIA REACTIONS WITH CL2 AND PET3 UNDER ULTRAHIGH-VACUUM CONDITIONS
    FARKAS, J
    CHI, KM
    HAMPDENSMITH, MJ
    KODAS, TT
    DUBOIS, LH
    [J]. JOURNAL OF APPLIED PHYSICS, 1993, 73 (03) : 1455 - 1460
  • [10] Fehlner F.P., 1970, OXID MET, V2, P59, DOI DOI 10.1007/BF00603582