Chemical environment of copper at the surface of a CuAl2 model alloy:: XPS, MEIS and TEM analyses

被引:26
作者
Liu, YW
Bailey, P
Noakes, TCQ
Thompson, GE
Skeldon, P
Alexander, MR
机构
[1] Univ Manchester, Ctr Corros & Protect, Manchester M60 1QD, Lancs, England
[2] CLRC, Daresbury Lab, Warrington, Cheshire, England
关键词
Cu alloy; XPS; MEIS; TEM; alumina; atmospheric oxidation;
D O I
10.1002/sia.1743
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
Air-formed oxide on a CuAl2 model alloy is shown to be free of copper species, with copper enriching in the alloy. With thickening of the oxide by anodizing, copper enriches further to a critical concentration at which its oxidation proceeds with incorporation of Cu(II) species into the film. Such species migrate more rapidly through the film than aluminium species. Incorporation of copper species is associated with generation of oxygen gas within the film and subsequent film rupture is due to release of the gas. Reduction of Cu(II) to Cu(I) species during XPS analysis is characterized and the accelerating role of charge neutralizing is highlighted. Copyright (C) 2004 John Wiley Sons, Ltd.
引用
收藏
页码:339 / 346
页数:8
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