Structuring of dielectric and metallic materials with ultrashort laser pulses between 20 fs and 3 ps

被引：12

作者：

Kruger, J ^{[1
]}

Kautek, W ^{[1
]}

Lenzner, M ^{[1
]}

Sartania, S ^{[1
]}

Spielmann, C ^{[1
]}

Krausz, F ^{[1
]}

机构：

[1] FED INST MAT RES & TESTING,LAB THIN FIL TECHNOL,D-12205 BERLIN,GERMANY

来源：

LASER APPLICATIONS IN MICROELECTRONIC AND OPTOELECTRONIC MANUFACTURING II | 1997年 / 2991卷

关键词：

ablation; laser processing; micromachining; structuring; femtosecond pulse laser; glass; silica; steel;

D O I：

10.1117/12.273740

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Laser-micromachining of barium aluminum borosilicate glass, fused silica and stainless steel has been extended down to a pulse duration of 20 fs generated by a Ti: sapphire laser system at a wavelength of 0.8 mu m. A systematic study shows that, below 100 fs, an enhanced precision and a substantial decrease of the ablation threshold fluence in comparison to pulse laser processing with pulses in the picosecond and nanosecond range could be achieved. The physical mechanism and the technical relevance of this novel microtechnology is discussed.

引用

页码：40 / 47

页数：8