Development and characterization of a wood adhesive using bagasse lignin

被引:156
作者
Khan, MA
Ashraf, SM [1 ]
Malhotra, VP
机构
[1] Jamia Millia Islamia, Mat Res Lab, Dept Chem, New Delhi 110025, India
[2] Micro Ind Corp, Delhi 110041, India
关键词
adhesive for wood; bagasse lignin; phenol formaldehyde; curing; lignin phenol formaldehyde adhesive;
D O I
10.1016/j.ijadhadh.2004.01.003
中图分类号
TQ [化学工业];
学科分类号
0817 ;
摘要
Bagasse is spent fiber left after extraction of sugar. It is mainly used as a fuel to concentrate sugarcane juice. In the present work, the possibility of preparing wood adhesives from bagasse has been explored. The parameters for the preparation of a lignin phenol formaldehyde (LPF) adhesive, (lignin concentration, formaldehyde to phenol molar ratio, catalyst concentration, reaction time and reaction temperature) have been optimized. It was found that up to 50% of phenol can be substituted by bagasse lignin to give LPF wood adhesive having better bonding strength in comparison to a control phenol formaldehyde (CPF) wood adhesive. Prepared resins were characterized using IR, DSC and TGA. IR spectra of LPF resin showed structural similarity with CPF resin. Thermal stability of LPF resin was found to be lower as compared to CPF resin. DSC studies reveal a lower curing temperature for LPF adhesive in comparison to CPF adhesive. A shelf-life study reveals that LPF exhibits consistent behavior as compared to CPF in respect to adhesive strength. (C) 2004 Elsevier Ltd. All rights reserved.
引用
收藏
页码:485 / 493
页数:9
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