Silica gel containing sulfur, nitrogen and oxygen as adsorbent centers on surface for removing copper from aqueous/ethanolic solutions

被引：75

作者：

Machado, RSA ^{[1
]}

da Fonseca, MG ^{[1
]}

Arakaki, LNH ^{[1
]}

Espinola, JGP ^{[1
]}

Oliveira, SF ^{[1
]}

机构：

[1] Univ Fed Paraiba, CCEN, Dept Quim, BR-58051900 Joao Pessoa, Paraiba, Brazil

来源：

TALANTA | 2004年 / 63卷 / 02期

关键词：

silica gel; thioglycolic acid adsorption; copper; heavy metals;

D O I：

10.1016/j.talanta.2003.10.048

中图分类号：

O65 [分析化学];

学科分类号：

070302 [分析化学]; 081704 [应用化学];

摘要：

Silica gel was modified firstly with aminepropyltrimethoxisilane obtaining the matrix named as SILNH2. The SILNH2 silica reacted subsequently with thioglycolic acid equivalent to Sil-Ntga. The elemental analysis showed the presence of 0.98 mmol g(-1) of organic moieties immobilized on silica. infrared and C-13 NMR spectroscopic data in con junction with thermogravimetric measurements are in agreement with the suggested functionalization. The ion adsorption properties of the silica equivalent to Sil-Ntga were Studied using copper ions in aqueous/ethanolic solutions in concentrations ranging from 4.0 x 10(-3) to 5.0 x 10(-2) mol dm(-3) at different temperatures. The new modified silica showed a good sorption ability for copper at lower temperatures and its reuse capacity was demonstrated. (C) 2003 Elsevier B.V. All rights reserved.

引用

页码：317 / 322

页数：6

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