Micromachined bolometers on polyimide

被引:24
作者
Mahmood, Aamer [1 ]
Butler, Donald P. [1 ]
Celik-Butler, Zeynep [1 ]
机构
[1] Univ Texas, Dept Elect Engn, Nanofab Ctr, Arlington, TX 76019 USA
基金
美国国家科学基金会;
关键词
microbolometers; flexible sensors; thermal sensors; wafer-level packaging; micromachining; finite-element analysis;
D O I
10.1016/j.sna.2006.03.006
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper presents design, fabrication and measured performance parameters of micromachined infrared detectors on polyimide substrates. The detectors are of bolometer type made of semiconducting yttrium-barium-copper oxide (YBCO) as the thermometer material and are built on a 40-50 mu m-thick layer of polyimide (PI5878G) that serves as a flexible substrate. A thin film of Si3N4 supports the detectors. Surface micromachining is used to isolate the detectors and the supporting nitride layer from the substrate. Despite being supported by a layer Of Si3N4, an average thermal conductivity of 5.61 x 10(7) W/K, comparable to self-supporting devices on flexible substrates has been measured. This opens the possibility of placing such flexible sensors on micromachined membranes, integrated with other functions such as pressure sensing to build "Smart Skin." Room-temperature responsivity of 7.4 x 10(3) V/W and detectivity of 6.6 x 10(5) cm, Hz(1/2)/W were demonstrated on 40 mu m x 40 mu m microbolometers. The effect of substrate heating was also investigated and was found not to cause cross talk between the pixels. If these sensors are to be used as part of multi-functional, flexible sensor systems, device-level vacuum packaging is necessary. This was investigated using computer simulations for structural analysis and found to be feasible. (c) 2006 Elsevier B.V. All rights reserved.
引用
收藏
页码:452 / 459
页数:8
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