Electromechanical instability of microscale structures

被引:37
作者
Yang, FQ [1 ]
机构
[1] Univ Kentucky, Dept Chem & Mat Engn, Lexington, KY 40506 USA
关键词
D O I
10.1063/1.1496123
中图分类号
O59 [应用物理学];
学科分类号
摘要
Electrical pull-in instability of microscale structures is an important failure mechanism in microelectromechanical systems (MEMS), in which there is no equilibrium state for the MEMS structures. Using the elastic membrane theory, the electromechanical interaction of a suspended MEMS structure in an electric field is presented. The statically mechanical deformation of the microscale membrane under electrostatic loading is examined. The critical value of electric voltage needed to pull the membrane into the contact with the substrate is determined analytically. The critical pull-in electric voltage is proportional to the square root of the residual tensile force and inversely proportional to the length of the membrane if the residual line tensile force is much larger than the line force due to the stretch of the membrane, while it is inversely proportional to the square of the membrane length if the membrane is initially stress free. The contact problem after the occurrence of the pull-in collapse phenomenon is studied. It turns out that the contact length between the membrane and the substrate increases with the increase of the membrane length and the electric voltage, and decreases with the tensile force in the membrane. A closed-form solution on the release-electric voltage is obtained, which depends on the membrane length and the tensile force. (C) 2002 American Institute of Physics.
引用
收藏
页码:2789 / 2794
页数:6
相关论文
共 14 条
[1]   EFFECTS OF ELEVATED-TEMPERATURE TREATMENTS IN MICROSTRUCTURE RELEASE PROCEDURES [J].
ABE, T ;
MESSNER, WC ;
REED, ML .
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 1995, 4 (02) :66-75
[2]   Effects of capacitors, resistors and residual charge on the static and dynamic performance of electrostatically-actuated devices [J].
Chan, EK ;
Dutton, RW .
DESIGN, TEST, AND MICROFABRICATION OF MEMS AND MOEMS, PTS 1 AND 2, 1999, 3680 :120-130
[3]  
CHU PB, 1994, IEEE INT CONF ROBOT, P820, DOI 10.1109/ROBOT.1994.351387
[4]   Adhesion hysteresis of silane coated microcantilevers [J].
De Boer, MP ;
Knapp, JA ;
Michalske, TA ;
Srinivasan, U ;
Maboudian, R .
ACTA MATERIALIA, 2000, 48 (18-19) :4531-4541
[5]   Accurate method for determining adhesion of cantilever beams [J].
de Boer, MP ;
Michalske, TA .
JOURNAL OF APPLIED PHYSICS, 1999, 86 (02) :817-827
[6]   IC-PROCESSED ELECTROSTATIC MICROMOTORS [J].
FAN, LS ;
TAI, YC ;
MULLER, RS .
SENSORS AND ACTUATORS, 1989, 20 (1-2) :41-47
[7]   Adhesion release and yield enhancement of microstructures using pulsed Lorentz forces [J].
Gogoi, BP ;
Mastrangelo, CH .
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 1995, 4 (04) :185-192
[8]   Development of a microelectromechanical system pressure sensor for rehabilitation engineering applications [J].
Ho, JJ ;
Fang, YK ;
Hsieh, MC ;
Ting, SF ;
Chen, GS ;
Ju, MS ;
Chen, TY ;
Huang, CR ;
Chen, CY .
INTERNATIONAL JOURNAL OF ELECTRONICS, 2000, 87 (06) :757-767
[9]   Surface micromachined capacitive ultrasonic transducers [J].
Ladabaum, I ;
Jin, XC ;
Soh, HT ;
Atalar, A ;
Khuri-Yakub, BT .
IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL, 1998, 45 (03) :678-690
[10]  
Mulhern G. T., 1993, P 7 INT C SOL STAT S, P296