A hybrid encapsulation method for organic electronics

被引：69

作者：

Kim, N. ^{[1
,2
]}

Potscavage, W. J., Jr. ^{[1
,3
]}

Domercq, B. ^{[1
,3
]}

Kippelen, B. ^{[1
,3
]}

Graham, S. ^{[1
,2
]}

机构：

[1] Georgia Inst Technol, Ctr Organ Photon & Elect, Atlanta, GA 30332 USA

[2] Georgia Inst Technol, George W Woodruff Sch Mech Engn, Atlanta, GA 30332 USA

[3] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30332 USA

来源：

APPLIED PHYSICS LETTERS | 2009年 / 94卷 / 16期

基金：

美国国家科学基金会;

关键词：

alumina; atomic layer deposition; fullerenes; organic semiconductors; plasma CVD; silicon compounds; solar cells; thin films; ATOMIC LAYER DEPOSITION; LIGHT-EMITTING DEVICES; BARRIER FILMS; PERMEATION; SILICON; AL2O3;

D O I：

10.1063/1.3115144

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

We report a thin-film encapsulation method for organic electronics that combines the deposition of a layer of SiOx or SiNx (100 nm) by plasma enhanced chemical vapor deposition followed by a layer of Al2O3 (10-50 nm) by atomic layer deposition and a 1-mu m-thick layer of parylene by chemical vapor deposition. The effective water vapor transmission rates of the encapsulation was (2 +/- 1)x10(-5) g/m(2) day at 20 degrees C and 50% relative humidity (RH). The encapsulation was integrated with pentacene/C-60 solar cells, which showed no decrease in conversion efficiency after 5800 h of exposure to air demonstrating the effectiveness of the encapsulation methodology.

引用

页数：3

共 16 条

[1] Improvements of permeation barrier coatings using encapsulated parylene interlayers for flexible electronic applications [J].