Stabilization of high ionic strength slurries using the synergistic effects of a mixed surfactant system

The stability of colloidal slurries is an important parameter in many industries due to problems that can arise as a result of particle settling. Particle settling is often caused by the shielding of surface charges on the particles which otherwise would prevent coagulation and subsequent settling. This is particularly a problem in high ionic strength slurries, where large amounts of ions serve to enhance the charge shielding and compression of the electrical double layer around the particles. This phenomenon has been investigated for industrially significant slurries used for tungsten and copper chemical mechanical polishing (CMP). It has been found that the effects of addition of conventional stabilizing agents (e.g., ionic surfactants, polymers) to these high ionic strength slurries are neutralized by the electrolytes in solution. However, the synergistic combination of a properly chosen ionic and nonionic surfactant has been found to be a suitable stabilizing agent for this type of system. For the CMP slurries investigated, the synergistic effect has been shown to be maximum for combinations of sodium dodecyl sulfate anionic surfactant and a variety of polymeric nonionic surfactants. The stabilization observed for these mixed surfactant systems has been explained in terms of adsorption of ionic surfactant on particle surfaces and nonionic surfactant molecules penetrating the film of the ionic surfactant due to hydrocarbon chain interactions. This brings about the steric stabilization of the slurry. (C) 2000 Academic Press.