An active, microfabricated, scalp electrode array for EEG recording

We describe the microfabrication, packaging, and testing of an active, dry, scalp electroencephalogram (EEC) electrode, The electrode consists of a silicon sensor substrate and a custom circuit substrate (2 mu m CMOS technology), A via-hole technology has been developed using reactive ion etching with SF6/O-2 gas mixture to make electrical contacts between the sensor and circuit substrates. These substrates and batteries (power source) are then assembled in a custom package for testing on bench and human subjects.