Low dielectric thermoset. IV. Synthesis and properties of a dipentene-containing cyanate ester and its copolymerization with bisphenol A dicyanate ester

被引:41
作者
Lin, CH [1 ]
Hsiao, CN
Li, CH
Wang, CS
机构
[1] Natl Chung Hsing Univ, Dept Chem Engn, Taichung 402, Taiwan
[2] Kun Shan Univ Technol, Dept Appl Fiber Style, Tainan 710, Taiwan
[3] Natl Chang Kung Univ, Dept Chem Engn, Tainan 710, Taiwan
关键词
dipentene; cyanate ester; BADCY; dielectric constant; dissipation factor; moisture absorption;
D O I
10.1002/pola.20226
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 [高分子化学与物理]; 080501 [材料物理与化学]; 081704 [应用化学];
摘要
A 2,6-dimethylphenol-dipentene dicyanate ester (DPCY) was synthesized from the reaction of 2,6-dimethylphenol-dipentene adduct and cyanogen bromide. The proposed structure was confirmed by Fourier transform infrared (FTIR), elemental analysis, mass, and nuclear magnetic resonance (NMR) spectra. DPCY was then cured by itself or cured with bisphenol A dicyanate ester (BADCY). Thermal properties of cured epoxy resins were studied using differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA), dielectric analysis (DEA), and thermogravimetric analysis (TGA). These data are compared with those of BADCY. The cured DPCY exhibits a lower dielectric constant (2.61 at 1 MHz), dissipation factor (29.3 mU at 1 MHz), thermal stability (5% degradation temperature and char yield are 429 degreesC and 17.64%, respectively), glass transition temperature (246 degreesC by TMA and 258 T by DMA), coefficient of thermal expansion (33.6 ppm before Tg and 134.1 ppm after Tg), and moisture absorption (0.95% at 48 h) than those of BADCY, but higher moduli (5.12 GPa at 150 degreesC and 4.60 GPa at 150 degreesC) than those of the bisphenol A system. The properties of cured cocyanate esters lie between cured BADCY and DPCY, except for moduli. Moduli of some cocyanate esters are even higher than those of cured BADCY and DPCY. A positive deviation from the Fox equation was observed for cocyanate esters. (C) 2004 Wiley Periodicals, Inc.
引用
收藏
页码:3986 / 3995
页数:10
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