Diffusion bonding of intermetallic Ti-47Al-2Cr-0.2Si sheet material and mechanical properties of joints at room temperature and elevated temperatures

被引:62
作者
Glatz, W
Clemens, H
机构
[1] MET WERK PLANSEE GMBH,CTR TECHNOL,A-6600 REUTTE,AUSTRIA
[2] MONTANUNIV,INST MET KUNDE & WERKSTOFFPRUFUNG,A-8700 LEOBEN,AUSTRIA
关键词
titanium aluminides based on TiAl; mechanical properties at ambient temperatures; mechanical properties at high temperatures; joining (diffusion-bonding);
D O I
10.1016/S0966-9795(97)00011-3
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
A series of diffusion bonding tests was conducted on fine-grained ingot metallurgical Ti-47Al-2Cr-0.2Si (at%) sheet material with applied stress in vacuum. Optical and scanning electron microscope (SEM) investigations revealed that defect-free joints could be achieved at a bonding temperature of 1000 degrees C in spite of variations of stress in the range 20-40 MPa and bonding time in the range 1-3 h. Apart from metallographical characterization, mechanical testing was performed to verify the bonding quality. Therefore, tensile specimens with wedge-shaped bonding zone geometry were cut from the joined sheet samples and tested at room temperature, 700 degrees C and 1000 degrees C with an initial strain rate of approximately 1 x 10(-4) s. The tensile test results indicated that the tensile properties of the joints are comparable to those of the base material. Finally, a dissimilar Ti-47Al-2Cr-0.2Si/Ti-6Al-4V diffusion bonding couple was produced, characterized and mechanically tested at room temperature and 700 degrees C. (C) 1997 Elsevier Science Limited.
引用
收藏
页码:415 / 423
页数:9
相关论文
共 20 条
[1]  
CAM G, 1996, INT WELD TECH 96 S P, P25
[2]  
Clemens H, 1995, GAMMA TITANIUM ALUMI
[3]  
CLEMENS H, 1996, ESA C P, V386, P1297
[4]  
DIMIDUK DM, 1992, MATER SCI TECH SER, V8, P367, DOI 10.1179/026708392790170847
[5]  
EBERHARDT N, 1995, THESIS ML U HALLE WI
[6]  
GLATZ W, 1995, EURO PM95 C P, V1, P501
[7]  
GLATZ W, UNPUB
[8]  
GLATZ W, 1996, STRUCTURE, V29, P3
[9]  
GODFREY SP, 1995, MATER RES SOC SYMP P, V364, P793
[10]  
HALL EL, 1990, MICROSTRUCTURE PROPE, P105