Manufacturing with DUV lithography

被引：26

作者：

Holmes, SJ

Mitchell, PH

Hakey, MC

机构：

来源：

IBM JOURNAL OF RESEARCH AND DEVELOPMENT | 1997年 / 41卷 / 1-2期

关键词：

D O I：

10.1147/rd.411.0007

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

Deep-UV (DUV) lithography has been developed to scale minimum feature sizes of devices on semiconductor chips to sub-half-micron dimensions. This paper reviews early manufacturing experiences at the IBM Microelectronics Division with deep ultraviolet (DUV) lithography at a 248-nm wavelength. Critical steps in the processing of 1Mb DRAM, 16Mb DRAM, and logic gate conductors in devices are discussed. The evolution of DUV lithography tools is also briefly reviewed.

引用

页码：7 / 19

页数：13

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