Fabrication of amorphous iron-boron films by electroless plating

被引：14

作者：

Fujita, N

Tanaka, A

Makino, E

Squire, PT

Lim, PB

Inoue, M

Fujii, T

机构：

[1] TOYOHASHI UNIV TECHNOL, DEPT ELECT & ELECT ENGN, TOYOHASHI, AICHI 441, JAPAN

[2] UNIV BATH, DEPT PHYS, BATH BA2 7AY, AVON, ENGLAND

来源：

APPLIED SURFACE SCIENCE | 1997年 / 113卷

关键词：

amorphous alloy films; iron-boron films; electroless plating; contact plating; magnetostrictive materials;

D O I：

10.1016/S0169-4332(96)00841-0

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

Amorphous iron-boron alloy films were fabricated by means of electroless plating, and the film formation mechanism was examined by studying the fabrication conditions. When a copper substrate in contact with an aluminum wire was used, the alloy films with considerably thick thicknesses were obtained. The local battery configuration of the copper substrate and the aluminum wire was considered to be responsible for the film formation. The boron content in the film increased monotonically from 0 at% to 28 at% with increasing the concentration of reducing agent (KBH4). The bath temperature during the plating was found to be a significant parameter for governing the reduction power of the reducing agent and the resultant crystallographic structure of the films.

引用

页码：61 / 65

页数：5